| 1. Minimum line width/line spacing |
3 mil/3 mil |
| 2. Minimum finished hole size |
4 mil |
| 3. Maximum aspect ratio |
1/10 |
| 4. Minimum SMT test pitch |
8mil |
| 5. Minimum SMT pitch |
10 mil |
| 6. Layer to layer registration tolerance |
2.5 mil |
| 7. Soldermask registration tolerance |
2.0mil |
| 8. Fiducial mark tolerance |
+/- 1 mil |
| 9. Board flatness tolerance |
+/- 5 mil per inch |
| 10. Maximum finish board size |
22" * 24" |
| 11. Hole size tolerance |
PTH +/-2.0mil, NPTH: +/-1mil |
| 12. Hole location tolerance |
+/- 2 mil |
| 13. Impedance control |
+- 7% |
| 14. Open/short tester |
250 Volt, 10M Ohm |
| 15. Minimum/maximun layer |
2/16 layers |
| 16. Board thickness |
4 Layers: 14 ~ 102 mil |
| |
8 Layers: 24 ~102mil |
| |
16 Layers: 72 mil ~ 102 mil |
| 17. Base Material |
FR4, CEM1, CEM2 |
| 18. Finished copper thickness |
1oz or 2oz |
| 19.Surface finish |
Lead Free HASL, Immersion silver, Immersion gold |
| 20. Certificates |
UL and RoHS compliance |
